Full Profile Inter-Layer Dielectric CMP Analysis
نویسندگان
چکیده
Chemical Mechanical Polishing (CMP) is currently being used in the fabrication of state-of-the-art integrated circuits, and has been identified as an enabling technology for the semiconductor industry in its drive toward gigabit chips and sub-130nm feature sizes. In this project we present the application of a library-based specular spectroscopic scatterometry method, which is capable of getting a clear view of the profile evolution due to the oxide CMP process. This level of analysis will be crucial in building a rigorous CMP model in the near future.
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